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无锡中镀科技有限公司 
| 联系人：方大清 先生 (经理) |
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| 电 话：0510-85790561 |
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手 机：17751262980  |
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| 电镀铟 电镀纯铟 铟 M-CONTACT IN-2000 卷对卷 |
InTech-2000
High Speed, Reel to Reel, Pure Indium
The InTech -2000 is a high-speed, high efficiency, stable electroplating system designed for the rapid deposition of pure indium at a wide range of current densities.
M-Contact InTech-2000 offers the advantage of being a pure indium, lead-free, plating process
providing an ultra-soft deposit that yields a uniform grain size, which is an excellent alternative to reduce the tendency for whisker growth. The process results in uniform, matte white deposits over a very wide cathode current density range. The resulting deposits have excellent reflow properties and are great for press fit applications.
InTech -2000是一种高速、高效、稳定的电镀系统，专为在广泛的电流密度下快速沉积纯铟而设计。 InTech -2000具有纯铟无铅电镀工艺的优势，提供超软镀层，产生均匀的晶粒尺寸，这是减少晶须生长趋势的绝佳选择。该工艺在极宽的阴极电流密度范围内产生均匀的哑光白色沉积 物。所得到的沉积物具有优异的回流性能，对压滤效果很好。
READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT
在使用本产品之前，请阅读完整的技术说明书
Features 特性 Benefits 优点
Operates over a wide current density range
在宽电流密度范围内工作 Uniform plating thickness regardless of part geometry
镀层厚度均匀，不考虑零件几何形状
Analyzable additives
可分析的添加剂 Easy to maintain and control
易于维护和控制
Simplified effluent treatment
简化污水处理
Environmentally friendly process
环保工艺
High efficiency
效率高 Consistent plating rate throughout the life of the bath
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